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    <description>Latest 20 threads of 半导体职场</description>
    <copyright>Copyright(C) 半导体微社区</copyright>
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      <title>[芯联汇] 半导体及封测产业发展趋势：EUV、GAA/CFET、HBM、CoWoS与Chiplet全面演进</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14484</link>
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      <author>zyadmin</author>
      <pubDate>Sun, 20 Sep 2026 13:00:13 +0000</pubDate>
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    <item>
      <title>[小江谈芯] 每周一盘（0921）</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14714</link>
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      <author>zyadmin</author>
      <pubDate>Sun, 20 Sep 2026 09:03:00 +0000</pubDate>
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    <item>
      <title>[芯项目1FIM] 2.8亿！先进封装空降江门？</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14569</link>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Sun, 20 Sep 2026 07:30:40 +0000</pubDate>
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    <item>
      <title>[芯联汇] DRAM接口基础教程：从DDR、GDDR、LPDDR到HBM，一文看懂存储架构演进</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14489</link>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Sun, 20 Sep 2026 07:06:29 +0000</pubDate>
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    <item>
      <title>[今日半导体] 2026先进异构封装技术论坛，11月11日 · 苏州！（聚焦2.5D/3D、CoWoS、Chiplet、混合键合、封装设备材料等企业齐聚），欢迎参展赞助！</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Sat, 19 Sep 2026 14:49:19 +0000</pubDate>
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    <item>
      <title>[苏州实验室的半导体之窗] 中国先进封装暗藏过剩风险，长电科技可能比盛合晶微更有看头</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Sat, 19 Sep 2026 04:30:00 +0000</pubDate>
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    <item>
      <title>[苏州实验室的半导体之窗] 台积电CoWoS与先进封装更新</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Fri, 18 Sep 2026 22:00:00 +0000</pubDate>
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    <item>
      <title>[小江谈芯] 6.5kVMOSFET浪涌能力研究（ABB-2020年）</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14715</link>
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      <pubDate>Fri, 18 Sep 2026 09:03:00 +0000</pubDate>
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    <item>
      <title>[天天IC] 投资超24亿，苏州先进封装项目启动</title>
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      <pubDate>Fri, 18 Sep 2026 05:44:13 +0000</pubDate>
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    <item>
      <title>[苏州实验室的半导体之窗] Arm 的 chiplet 生态系统，面向 AI 数据中心</title>
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      <pubDate>Fri, 18 Sep 2026 04:30:00 +0000</pubDate>
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    <item>
      <title>[芯片测试实验室] 捡了一枚水滴形物件 可司南 三体世界来的？</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Thu, 17 Sep 2026 23:36:02 +0000</pubDate>
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    <item>
      <title>[资深半导体人] 硅基中介层与玻璃基中介层对比分析</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Thu, 17 Sep 2026 16:05:00 +0000</pubDate>
    </item>
    <item>
      <title>[今日半导体] 重磅！上海又一2.5D/3D先进封装新项目，启动！</title>
      <link>https://club.iccourt.com/forum.php?mod=viewthread&amp;tid=14639</link>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Thu, 17 Sep 2026 15:21:58 +0000</pubDate>
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    <item>
      <title>[今日半导体] 24.54亿！苏州又一先进封装项目，启动</title>
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      <category>半导体职场</category>
      <author>zyadmin</author>
      <pubDate>Wed, 16 Sep 2026 13:08:14 +0000</pubDate>
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      <title>[小江谈芯] 课件推送（沟槽栅功率MOSFET雪崩能力全面介绍-晏小北）</title>
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      <pubDate>Wed, 16 Sep 2026 09:02:03 +0000</pubDate>
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    <item>
      <title>[芯片工坊] 混合键合（Hybrid Bonding）：把两片晶圆\"焊\"在一起</title>
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      <pubDate>Wed, 16 Sep 2026 00:30:00 +0000</pubDate>
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    <item>
      <title>[十二芯座] AMAT 2026 大师课：DRAM和先进封装技术的发展</title>
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      <pubDate>Tue, 15 Sep 2026 16:00:00 +0000</pubDate>
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      <title>[今日半导体] 7.1亿！广州一先进封装基板项目，中标</title>
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      <pubDate>Tue, 15 Sep 2026 13:05:07 +0000</pubDate>
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      <title>[芯片测试实验室] 价格不贵的ADI微型阻抗分析模块</title>
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      <pubDate>Tue, 15 Sep 2026 05:36:36 +0000</pubDate>
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      <title>[小江谈芯] 每周一盘（0914）</title>
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      <author>zyadmin</author>
      <pubDate>Mon, 14 Sep 2026 09:02:32 +0000</pubDate>
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