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    <description>Latest 20 threads of 封装测试</description>
    <copyright>Copyright(C) 半导体微社区</copyright>
    <generator>Discuz! Board by Discuz! Team</generator>
    <lastBuildDate>Mon, 21 Sep 2026 07:57:46 +0000</lastBuildDate>
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      <title>[天天IC] 近5亿！国产光刻胶，重磅收购！</title>
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      <category>封装测试</category>
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      <pubDate>Sun, 20 Sep 2026 09:16:24 +0000</pubDate>
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    <item>
      <title>[SEMI炉管设备攻城狮] 半导体芯片制造晶圆基板类型</title>
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      <category>封装测试</category>
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      <pubDate>Sat, 19 Sep 2026 22:00:00 +0000</pubDate>
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    <item>
      <title>[光学与半导体综研] 光刻机研发专题（八）：磁悬浮晶圆台的驱动、导向与承载原理</title>
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      <author>zyadmin</author>
      <pubDate>Sat, 19 Sep 2026 04:00:00 +0000</pubDate>
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    <item>
      <title>[SEMI炉管设备攻城狮] 认识CD‑SEM：半导体制造的超级显微镜与纳米量测核心</title>
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      <category>封装测试</category>
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      <category>封装测试</category>
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      <pubDate>Fri, 18 Sep 2026 05:44:13 +0000</pubDate>
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      <category>封装测试</category>
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      <pubDate>Fri, 18 Sep 2026 04:00:00 +0000</pubDate>
    </item>
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      <pubDate>Thu, 17 Sep 2026 22:00:00 +0000</pubDate>
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      <pubDate>Thu, 17 Sep 2026 08:40:05 +0000</pubDate>
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    <item>
      <title>[光学与半导体综研] 光刻机研发专题（六）：先进光刻机晶圆平台的总体机械架构</title>
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      <pubDate>Thu, 17 Sep 2026 04:00:00 +0000</pubDate>
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      <title>[SEMI炉管设备攻城狮] Applied Materials 在 HBM 中的解决方案 ！</title>
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      <pubDate>Wed, 16 Sep 2026 09:22:53 +0000</pubDate>
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      <pubDate>Wed, 16 Sep 2026 05:23:17 +0000</pubDate>
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      <pubDate>Wed, 16 Sep 2026 04:00:00 +0000</pubDate>
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